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Producer: CHIMEI

CHIMEI 757 ABS Resin

Grade: 757

MFR: ml/10 min | 220°C×10KG | 18 | 1133 g/10 min

Density: g/cm³ | 23 °C | 1.05 | 1183 g/cm³

Key Product Data

Commercial and technical details for sourcing and evaluation.

Grade: 757

Producer: CHIMEI

CAS Number: 9003-56-9

HS Code: 3903309000

MFR: ml/10 min | 220°C×10KG | 18 | 1133 g/10 min

Density: g/cm³ | 23 °C | 1.05 | 1183 g/cm³

MOQ: 1X40FT

Loading Port: Xiamen,Shanghai

Product Overview

CHIMEI 757 is a ABS Resin grade. MFR / Melt Index: ml/10 min | 220°C×10KG | 18 | 1133. Density: g/cm³ | 23 °C | 1.05 | 1183. CAS No.: 9003-56-9. HS Code: 3903309000. MOQ: 1X40FT. Port: Xiamen,Shanghai.

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PRODUCT DETAIL

Description

CHIMEI 757 is a ABS Resin grade. MFR / Melt Index: ml/10 min | 220°C×10KG | 18 | 1133. Density: g/cm³ | 23 °C | 1.05 | 1183. CAS No.: 9003-56-9. HS Code: 3903309000. MOQ: 1X40FT. Port: Xiamen,Shanghai.

Technical & Commercial Data

Grade

757

Producer

CHIMEI

CAS Number

9003-56-9

HS Code

3903309000

MFR

ml/10 min | 220°C×10KG | 18 | 1133 g/10 min

Density

g/cm³ | 23 °C | 1.05 | 1183 g/cm³

Packaging

MOQ

1X40FT

Loading Port

Xiamen,Shanghai

Need price, availability or a grade match?

Tell us the application, quantity and destination port. We will reply with a suitable supply option.

Request a Quote

CHIMEI 757 ABS Resin

CHIMEI

Short Description:

Industrial plastic material supplied for international sourcing, sampling and bulk orders.

CHIMEI 757 is a ABS Resin grade. MFR / Melt Index: ml/10 min | 220°C×10KG | 18 | 1133. Density: g/cm³ | 23 °C | 1.05 | 1183. CAS No.: 9003-56-9. HS Code: 3903309000. MOQ: 1X40FT. Port: Xiamen,Shanghai.

Producer: CHIMEI

Grade: 757

MFR: ml/10 min | 220°C×10KG | 18 | 1133

CAS Number: 9003-56-9

HS Code: 3903309000

MOQ: 1X40FT

PRODUCT DETAIL

Description

CHIMEI 757 is a ABS Resin grade. MFR / Melt Index: ml/10 min | 220°C×10KG | 18 | 1133. Density: g/cm³ | 23 °C | 1.05 | 1183. CAS No.: 9003-56-9. HS Code: 3903309000. MOQ: 1X40FT. Port: Xiamen,Shanghai.

Technical & Commercial Data

Grade

757

Producer

CHIMEI

CAS Number

9003-56-9

HS Code

3903309000

MFR

ml/10 min | 220°C×10KG | 18 | 1133 g/10 min

Density

g/cm³ | 23 °C | 1.05 | 1183 g/cm³

Packaging

MOQ

1X40FT

Loading Port

Xiamen,Shanghai

Need price, availability or a grade match?

Tell us the application, quantity and destination port. We will reply with a suitable supply option.

Request a Quote

PRODUCT DETAIL

Product Information

Technical & Commercial Data

Grade

757

Producer

CHIMEI

CAS Number

9003-56-9

HS Code

3903309000

MFR

ml/10 min | 220°C×10KG | 18 | 1133 g/10 min

Density

g/cm³ | 23 °C | 1.05 | 1183 g/cm³

Packaging

MOQ

1X40FT

Loading Port

Xiamen,Shanghai

Description

CHIMEI 757 is an ABS Resin grade.

Product Specification

PropertyUnitSpecificationResultTest Method
Melt Flow Indexml/10 min220°C×10KG181133
Mass Densityg/cm³23 °C1.051183
Tensile StrengthMPa50 mm/min, yield47527
MPa50 mm/min, break34527
Tensile Elongation%50 mn/min30527
Flexural ModulusGPa2 mm/min2.2178
Flexural StrengthMPa2 mm/min76178
Izod Impact StrengthKJ/m223 °C Notched19180/1A
KJ/m2-30 °C Notched9180/1A
Vicat Softening Temperature℃1 Kg,50 °C/hr104306
°C5 Kg,50 °C/hr100306
Heat Distortion Temp°C1.8 MPa Unannealed8375/A
°C1.8 MPa Annealed9875/A

Typical values should be confirmed against the latest producer-issued TDS before final use.

Need price, availability or a grade match?

Tell us the application, quantity and destination port. We will reply with a suitable supply option.

Request a Quote

Request a price or a grade match

Tell us the resin, the quantity and where it ships. We reply by email with price, availability and the TDS for the grade.