Description
Huafon EP158 is a PA66 Resin grade.
Product Specification
| Property | Test Method | Test Conditions | Unit | Test Result |
|---|---|---|---|---|
| Grade | EP158 | |||
| Chemical & Physical Properties | ||||
| Relative viscosity | GB/T 12006.1 | Chips | – | 2.67 ± 0.03 |
| Heterogeneous spot 0.3mm ≤ diameter ≤ 1.0mm | Q/HF 001 | Chips | pcs/kg | ≤ 5 |
| Heterogeneous spot diameter ≥ 1.0mm | Q/HF 001 | Chips | pcs/kg | 0 |
| -NH2 | Q/HF 001 | Chips | mmol/kg | 40.0–50.0 |
| Water content | GB/T 6283 | Chips | mg/kg | ≤ 4000 |
| Appearance | Q/HF 001 | Chips | – | Transparent particle |
| Yellow Index | GB/T 39822 | Chips | – | ≤ -2 |
| Particle size | Q/HF 001 | Chips | g/100 pcs | 1.7 ± 0.3 |
| Melt flow rate | ISO 1133 | 275℃, 2.16kg; Wet | g/10min | 78.5 |
| Melt flow rate | ISO 1133 | 275℃, 2.16kg; Dry | g/10min | 27.3 |
| Mechanical Properties | ||||
| Charpy notched impact | ISO 179 | 23℃; 48h/23℃/50%RH | kJ/m² | 6.4 |
| Tensile strength | ISO 527 | 48h/23℃/50%RH | MPa | 75.6 |
| Elongation at break | ISO 527 | 48h/23℃/50%RH | % | 79 |
| Flexural modulus | ISO 178 | 48h/23℃/50%RH | MPa | 2693 |
| Flexural strength | ISO 178 | 48h/23℃/50%RH | MPa | 99 |
| Thermal Properties | ||||
| Heat deflection temperature | ISO 75 | 1.80MPa; 48h/23℃/50%RH | ℃ | 65 |
| Melting point | ASTM D3418 | 10℃/min; Chips | ℃ | 262 |
| Others | ||||
| Flammability Class | UL 94 | 0.70mm; 48h/23℃/50%RH | – | V-2 |
| Flammability Class | UL 94 | 1.00mm; 48h/23℃/50%RH | – | V-2 |
| Flammability Class | UL 94 | 1.60mm; 48h/23℃/50%RH | – | V-2 |
Typical values should be confirmed against the latest producer-issued TDS before final use.